TLE7263E Integrated System Basis Chip with HS-CAN, LIN, Dual LDO and High-Side Switch for Automotive Door Modules

The TLE7263E is a monolithic integrated System Basis Chip (SBC) specifically designed for CAN-LIN gateway and automotive body control applications, including door modules, window lift systems, and seat control units . This device combines multiple smart power functions into a single enhanced power package, significantly reducing component count and PCB space compared to discrete implementations .

For data communication, the TLE7263E integrates a High-Speed CAN transceiver supporting data rates up to 1 MBaud and a LIN transceiver with transmission rates up to 20 kBaud, fully compatible with LIN specification 1.3 and 2.0 . The device also features a 16-bit SPI interface for full digital control and diagnostic monitoring .

Power management is handled by two integrated low-dropout voltage regulators (LDOs), each capable of delivering 150mA at 5V with ±2% accuracy, providing stable power for external microcontrollers and peripherals . The integrated 150mA high-side switch offers additional load driving capability for wake-up circuitry or other controlled loads .

The device incorporates comprehensive system protection and diagnostic features, including a window watchdog with reset function, over-temperature shutdown, short-circuit protection, power-on and undervoltage reset generation, and a VBAT monitoring with fail-safe output . Four monitoring and wake-up inputs allow flexible system wake-up from bus messages or external events .

For low-power applications, the TLE7263E supports multiple power-saving modes, including Sleep Mode with typical current consumption of only 50µA and a Stop Mode with cyclic sense capability . The device is AEC-Q100 qualified and specified for the full automotive temperature range of -40°C to 150°C . It is available in a compact PG-DSO-36 surface-mount package with exposed pad for enhanced thermal dissipation .