{"product_id":"tle7263e-integrated-system-basis-chip-with-hs-can-lin-dual-ldo-and-high-side-switch-for-automotive-door-modules","title":"TLE7263E Integrated System Basis Chip with HS-CAN, LIN, Dual LDO and High-Side Switch for Automotive Door Modules","description":"\u003cp\u003eThe TLE7263E is a monolithic integrated System Basis Chip (SBC) specifically designed for CAN-LIN gateway and automotive body control applications, including door modules, window lift systems, and seat control units . This device combines multiple smart power functions into a single enhanced power package, significantly reducing component count and PCB space compared to discrete implementations .\u003c\/p\u003e\n\u003cp\u003eFor data communication, the TLE7263E integrates a High-Speed CAN transceiver supporting data rates up to 1 MBaud and a LIN transceiver with transmission rates up to 20 kBaud, fully compatible with LIN specification 1.3 and 2.0 . The device also features a 16-bit SPI interface for full digital control and diagnostic monitoring .\u003c\/p\u003e\n\u003cp\u003ePower management is handled by two integrated low-dropout voltage regulators (LDOs), each capable of delivering 150mA at 5V with ±2% accuracy, providing stable power for external microcontrollers and peripherals . The integrated 150mA high-side switch offers additional load driving capability for wake-up circuitry or other controlled loads .\u003c\/p\u003e\n\u003cp\u003eThe device incorporates comprehensive system protection and diagnostic features, including a window watchdog with reset function, over-temperature shutdown, short-circuit protection, power-on and undervoltage reset generation, and a VBAT monitoring with fail-safe output . Four monitoring and wake-up inputs allow flexible system wake-up from bus messages or external events .\u003c\/p\u003e\n\u003cp\u003eFor low-power applications, the TLE7263E supports multiple power-saving modes, including Sleep Mode with typical current consumption of only 50µA and a Stop Mode with cyclic sense capability . The device is AEC-Q100 qualified and specified for the full automotive temperature range of -40°C to 150°C . It is available in a compact PG-DSO-36 surface-mount package with exposed pad for enhanced thermal dissipation .\u003c\/p\u003e","brand":"Qlnova","offers":[{"title":"Default Title","offer_id":45422258520173,"sku":null,"price":16.15,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0632\/5950\/8845\/files\/TLE7263E-3.webp?v=1783047018","url":"https:\/\/qlnova.com\/products\/tle7263e-integrated-system-basis-chip-with-hs-can-lin-dual-ldo-and-high-side-switch-for-automotive-door-modules","provider":"Qlnova","version":"1.0","type":"link"}